Each new embedded system tends to integrate more sensors with tight software-driven control, digitally assisted analog circuits, and heterogeneous structure. A more responsive simulation environment is needed to support the co-design and verification of such complex architectures including all its digital hardware/software and analog/multi-physical aspects using Multi-Disciplinary Virtual Prototyping (MDVP). Taking a Micro-Electro-Mechanical System (MEMS) vibration sensor as an example, we introduce a reusable framework based on the state-of-the-art technologies SystemC AMS, Finite Elements/Reduced-Order modeling, and UVM to design, simulate, and verify such systems in their real application context.


  author={T. Maehne and Z. Wang and B. Vernay and L. Andrade and C. Ben Aoun and J. P. Chaput and M. M. Louërat and F. Pêcheux and A. Krust and G. Schröpfer and M. Barnasconi and K. Einwich and F. Cenni and O. Guillaume},
  booktitle={2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)},
  title={UVM-SystemC-AMS based framework for the correct by construction design of MEMS in their real heterogeneous application context},
  keywords={embedded systems;microsensors;vibrations;virtual prototyping;MEMS vibration sensor;UVM-SystemC-AMS based framework;complex architectures;embedded system;heterogeneous application context;multidisciplinary virtual prototyping;Integrated circuit modeling;Micromechanical devices;Sensor systems;Solid modeling;Vibrations;Virtual prototyping;Micro-Electro-Mechanical System (MEMS);Multi-Disciplinary Virtual Prototyping (MDVP);SystemC AMS;Universal Verification Methodology (UVM);bond graph formalism;design and verification methodology;dimensional analysis;reduced-order modeling},